About this role
Key Responsibilities
- Maintain and support wire bond equipment to ensure high uptime and reliability.
- Troubleshoot equipment issues and implement effective corrective actions.
- Perform preventive maintenance and drive continuous equipment improvements.
- Support production operations and minimize equipment downtime.
- Work with Process, Production, and Quality teams to improve yield and product quality.
- Lead and drive equipment qualification, sustaining , upgrade and automation projects.
- Analyze equipment performance data and implement productivity improvements.
- Develop and maintain maintenance procedures, work instructions, and technical documentation.
- Train and mentor technicians on equipment operation and troubleshooting.
Requirements
- Bachelor's degree or above in Engineering related field (Mechanical, Electrical are preferred).
- Minimum 3 years of semiconductor manufacturing experience.
- Strong troubleshooting and root cause analysis skills.
- Familiar with SPC, FMEA, 8D, and continuous improvement methodologies.
- Good communication and teamwork skills.
- Able to support a fast-paced manufacturing environment.
Preferred Qualifications
- TOEIC >600 or other English comprehensive certification
- Experience with wire bonder, eg K&S Rapid; ASM AERO...etc
- Knowledge of automation, SECS/GEM, and equipment data analysis.
- Six Sigma Green Belt or equivalent certification.
More information about NXP in Greater China...
#LI-2370