<New Graduate Hiring> Marking Process Engineer

NXP SemiconductorsKaohsiung, TakaoOn-siteFull-timeNew grad, 0–1 yearsListed 2 months ago

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About this role

Responsibilities :
• Process engineer include Molding and Laser Marking process. Well-known Assembly front-end & back-end process is preferred. • Focus on process maintenance and improvement, new technology development, and continues yield improvement. • Collaboration with related departments including internal or external.
Qualifications :
• Bachelor or Master's degree, major in Mechanical or Material Engineering or other related disciplines • Seniority less than 2 years. • Ability to speak and write in English fluently. • Good communication (Chinese and English) and emotion management.. • Learning, innovation, fast-paced, and teamwork.
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