Senior Advanced Packaging & Reliability Engineer

Help Us Solve One of the Biggest Challenges in Next-Generation Electronics

At Smart High Tech , we develop advanced thermal management materials and solutions designed for some of the world's most demanding applications within AI, semiconductors, high-performance computing and advanced electronics.

As semiconductor architectures become increasingly powerful and complex, advanced packaging, heterogeneous integration and higher power densities are creating new challenges in thermal management, interfaces and long-term reliability.

We are now strengthening our R&D team with a Senior Advanced Packaging & Reliability Engineer .

This is a highly technical role for someone who wants to work at the intersection of advanced materials, semiconductor packaging, thermal management and reliability engineering .

Your Mission

As Senior Advanced Packaging & Reliability Engineer, you will help us understand how our materials and solutions perform within advanced semiconductor and electronics packaging environments.

You will work with the mechanical, thermal and reliability challenges associated with next-generation packaging and interconnect technologies – combining simulation, experimental validation, failure analysis and materials understanding .

You will collaborate closely with our R&D, materials, process engineering and product development teams, as well as external technology partners and customers.

Your work will contribute directly to the development, qualification and industrialisation of Smart High Tech's next generation of thermal management solutions.

What You'll Be Doing

Advanced Packaging & Interconnects

- Support the development and evaluation of materials for advanced semiconductor packaging applications.
- Investigate material and interface behaviour in advanced packaging structures.
- Work with technologies such as 2.5D/3D integration, heterogeneous integration, flip-chip, wafer-level packaging and advanced interconnects .
- Evaluate thermal-mechanical interactions between materials, interfaces and packaging structures.
- Contribute technical expertise to product development and customer qualification activities.

Reliability Engineering

- Develop and execute reliability assessment methodologies for materials, interfaces and packaging structures.
- Study failure mechanisms related to thermal cycling, mechanical stress, fatigue, creep and interfacial degradation.
- Analyse the impact of temperature, mechanical loading and material properties on long-term reliability.
- Translate reliability results into recommendations for material, product and process improvements.

Modelling & Simulation

- Perform finite element analysis (FEA) and thermo-mechanical simulations.
- Model stresses, deformation, interfaces and failure mechanisms in electronic packaging structures.
- Use simulation to understand material behaviour and support product optimisation.
- Correlate simulation results with experimental data.

Experience with ANSYS, Abaqus and/or COMSOL is highly relevant.

Failure Analysis & Characterisation

- Investigate material, interface and packaging failures.
- Perform root-cause analysis and translate findings into engineering improvements.
- Work with experimental characterisation techniques and collaborate with internal and external laboratories.
- Support the development of test methods for material and product qualification.

Research & Technology Development

- Follow developments within advanced semiconductor packaging, thermal management and reliability.
- Identify emerging technologies relevant to Smart High Tech's product roadmap.
- Collaborate with universities, research institutes, customers and technology partners.
- Contribute to technical publications, patents and intellectual property development where relevant.

What We're Looking For

You have a strong scientific and engineering foundation combined with practical experience in semiconductor or power electronics packaging.

Required Qualifications

- MSc or PhD in Electronic Packaging, Microelectronics, Materials Science, Mechanical Engineering, Applied Mechanics or a closely related field.
- Experience in semiconductor packaging and/or power electronics packaging .
- Strong understanding of advanced packaging technologies, materials and interfaces.
- Experience in reliability engineering and/or failure analysis .
- Experience with thermo-mechanical modelling and finite element analysis.
- Practical experience with ANSYS, Abaqus and/or COMSOL .
- Strong analytical and problem-solving capabilities.
- Ability to work across simulation, experimental data and physical failure mechanisms.
- Fluent English, both written and spoken.

It's a Strong Plus If You Have

- A PhD within microelectronics, electronic packaging, materials science, mechanics or a related discipline.
- Experience from leading semiconductor companies, packaging companies or research institutes.
- Experience from environments such as IMEC, TU Delft, Fraunhofer, Max Planck, NXP, Nexperia, Infineon, STMicroelectronics, Intel, TSMC, ASE or Amkor .
- Experience with 3D integration, heterogeneous integration, WLCSP, flip-chip or fine-pitch interconnect technologies .
- Knowledge of solder joints, Cu-based interconnects, sintered materials, microbumps or bonding technologies.
- Experience investigating electromigration, thermal fatigue, creep, fracture or interfacial reliability .
- Experience with semiconductor characterisation methods such as SEM, TEM, FIB or related techniques .
- Publications, patents or conference contributions within advanced packaging, interconnect technologies, materials or reliability.

Who You Are

You're technically curious and enjoy understanding why materials and interfaces behave the way they do .

You are comfortable moving between modelling, experiments and physical analysis rather than working within only one engineering discipline.

You enjoy solving complex technical problems and can translate scientific findings into practical engineering decisions.

At the same time, you thrive in an entrepreneurial environment where priorities move quickly and where your expertise can have a direct impact on products, customers and the company's technology roadmap.

Why Join Smart High Tech?

At Smart High Tech, you'll have the opportunity to work with advanced materials and thermal management technologies addressing one of the fundamental challenges facing next-generation computing: heat .

As AI processors, GPUs and advanced semiconductor architectures continue to increase in performance and power density, thermal management and packaging reliability are becoming increasingly critical.

You'll join us at an exciting stage of our journey – working closely with experienced researchers, engineers and international technology partners as we move from advanced R&D towards industrialisation and global scale.

This is an opportunity to combine deep scientific expertise with real-world industrial impact .

Ready to Join Us?

If you have a background in advanced packaging, reliability engineering or microelectronics and want to contribute to the next generation of thermal management technology, we'd like to hear from you.

Apply today. Applications will be reviewed continuously.