Photonics Product Engineering Lead

Аbout GlobalFoundries

GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GF makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit  www.gf.com .

Key Responsibilities:

- Support the design of advanced packages for high-speed optical interconnect and networking products under the guidance of senior packaging engineers, contributing to layout, floorplanning, and design documentation.
- Assist in developing substrate routing and interconnect for FCBGA/FCCSP, organic substrate, and 2.5D/3D package architectures supporting Co-Packaged Optics (CPO) and pluggable optics.
- Perform package layout tasks using industry-standard EDA/package design tools, and help maintain design libraries, stack-ups, and documentation.
- Assist with signal and power integrity checks, design rule checks, and basic controlled-impedance and differential-pair routing under supervision.
- Support data collection and analysis for package characterization, reliability evaluation, and design verification activities.
- Participate in design reviews, capture action items, and help track design deliverables and schedules.
- Collaborate with cross-functional design, assembly, test, and manufacturing teams to learn end-to-end package development flows.
- Continuously build technical expertise in advanced packaging technologies, high-speed interconnect design, and optical packaging fundamentals.

Required Qualifications :

- BS or MS in Electrical Engineering, Mechanical Engineering, Packaging Engineering, or a related discipline.
- 0–2 years of experience in semiconductor package design, PCB design, or related work (internships, co-ops, and academic projects considered).
- Foundational understanding of semiconductor packaging concepts such as FCBGA/FCCSP, organic substrates, interposers, and flip-chip assembly.
- Basic knowledge of high-speed signaling concepts, including transmission lines, controlled impedance, and differential pairs.
- Exposure to EDA, package/PCB layout, or simulation tools.
- Familiarity with data analysis or scripting tools such as Python or MATLAB is a plus.
- Strong analytical, problem-solving, and organizational skills, with attention to detail.
- Good communication skills and eagerness to learn in a collaborative, cross-functional environment.
- Self-motivated, adaptable, and able to take direction while growing technical independence.

We Offer

- Base Salary
- Equity
- Annual Bonus Plan
- Medical Insurance

Information about our benefits you can find here: https://gf.com/careers/opportunities-in-europe/