About this role
Responsibilities:
We are seeking an experienced Front‑of‑Line (FOL) Lead to own and optimize IC assembly/process steps up to EOL handoff in a high‑volume OSAT environment. The ideal candidate brings deep process expertise across wafer bump/RDL, wafer thinning & dicing, die prep, die attach, wire bond/flip‑chip attach, underfill, molding, singulation , and pre‑test/readiness , driving yield, cost, cycle time , and reliability improvements while ensuring stable HVM at OSATs.
Key Responsibilities:
- Own end‑to‑end FOL process flows for assigned packages (e.g., QFN/QFP, BGA/FCBGA, WLCSP, SIP/POP ).
- Define, optimize, and maintain process windows , golden parameters , and control plans for:
- Wafer‑level : RDL, UBM, bumping (Cu pillar/SnAg), wafer thinning, WLCSP passivation, dicing/saw.
- Die prep/attach : die singulation, pick/place, epoxy/DAF attach, eutectic/Ag‑sinter, FC attach.
- Interconnect : wire bond (Au/Cu/Al), stud bumping, flip‑chip reflow; underfill/edge‑bonding.
- Encapsulation & singulation : transfer mold/compression mold, post‑mold cure, saw/laser singulation.
- Own cost of manufacturing (COM) levers: materials usage (epoxy, underfill, mold compound), rework, tool life, consumables, and setup optimization
- Create package build plans , control plans , and risk assessments (PFMEA) for new products/packages.
- Lead engineering builds , pilot runs , correlation plans , and ramp‑to‑HVM with stable yields and CPK.
Essential Attributes
- Proven track record in advanced IC packaging : Wirebond, Flip-Chip, WLCSP, SiP, Fan-Out, or 2.5D/3D.
- Deep hands-on experience with APQP/PPAP , SPC/MSA/DOE , FMEA , 8D , and reliability (JEDEC/AEC).
- Strong understanding of assembly/process flows and failure modes (e.g., delamination, bond lift, die crack, BLR/CLR, substrate warpage).
- Customer-facing quality ownership, including escalation handling and audit leadership .
- Experience with automotive (IATF 16949) or AEC-Q100/104 qualification.
Qualifications
- Bachelor’s/Master’s in Materials, Mechanical, Electronics, Packaging, or Manufacturing Engineering (or related).