About this role
NPI Engineer
The Role
We are seeking a highly skilled and motivated Process Engineering expert in Photonics to own the manufacturing process development for our state-of-the-art photonic products. This is a hands-on role responsible for bridging the gap between design and high-volume production.
You will be a technical expert for our assembly and packaging processes, with a special focus on Silicon Photonics devices. Your primary mission will be to develop robust, scalable, and cost-effective manufacturing processes and transfer them successfully to our production partners. If you are a data-driven engineer who thrives on solving complex manufacturing challenges, this is the role for you.
What You'll Do (Responsibilities)
- Process Development & Optimization: Lead the hands-on development, characterization, and optimization of core assembly processes, including precision die bonding, wire bonding, and active/passive optical alignment.
- High-Volume Scalability: Design, develop, and qualify manufacturing processes and equipment with a clear path to ramping to high-volume manufacturing (HVM). Define equipment specifications and drive the design of custom fixtures and tooling.
- Statistical Process Control (SPC): Implement and manage SPC for critical process parameters. Use statistical methods (DOE, Cp/Cpk analysis) to monitor process health, drive yield improvements, and ensure manufacturability.
- Silicon Photonics Assembly: Serve as the subject matter expert for the unique challenges associated with Silicon Photonics device assembly , including fiber attach, thermal management, and high-density interconnects.
- Design for Manufacturability (DFM): Work closely with the design engineering team to provide critical DFM feedback, ensuring that new products are designed for robust, high-yield manufacturing.
- Yield Improvement: Drive root cause analysis for yield excursions and process failures. Implement robust corrective and preventative actions to achieve and exceed yield targets.
- Manufacturing Transfer: Create comprehensive documentation (work instructions, control plans, PFMEAs) and lead the technical transfer of new products and processes to our contract manufacturing (CM) partners.
What You'll Bring (Qualifications)
Minimum Qualifications:
- Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or a related technical field.
- 5+ years of experience in a process engineering or NPI role within the semiconductor, electronics, or photonics packaging industry.
- Direct, hands-on experience developing and sustaining key assembly processes such as precision die bonding, wire bonding, optical alignment and wafer level processing
- Demonstrated experience working with Silicon Photonics devices and their associated assembly and packaging processes.
- Proficiency in applying Statistical Process Control (SPC) and Design of Experiments (DOE) to solve manufacturing problems.
Preferred Qualifications:
- Master’s degree or PhD in a relevant technical discipline.
- A proven track record of successfully developing manufacturing processes and ramping them into high-volume manufacturing.
- Deep expertise in materials (e.g., epoxies, solders) and characterization techniques used in microelectronic and photonic assembly.
- Experience specifying, sourcing, and qualifying automated or semi-automated manufacturing equipment.
- Experience with statistical analysis software such as JMP or Minitab.
- Experience working with and managing offshore contract manufacturers (CMs).
- Strong problem-solving skills and a hands-on, data-driven approach.