ENGINEER SR, PACKAGE DEVELOPMENT

onsemiSeremban, Negeri SembilanOn-siteFull-timeSenior, 5–8 yearsListed 16 hours ago

Apply now

About this role

The Senior NPI Assembly Engineer is responsible for executing New Product Introduction (NPI) activities related to semiconductor assembly processes from development through high-volume manufacturing. This role serves as the technical owner for assembly process qualification, process optimization, risk assessment, and production readiness, ensuring new products meet quality, cost, reliability, and manufacturing requirements.

The engineer collaborates closely with Product Engineering, Process Engineering, Quality, Equipment Engineering, Supply Chain, and Customers to ensure successful product transfers, process characterization, and ramp-up activities.

Education

- Bachelor's Degree in:

Electrical Engineering

- Electronics Engineering

- Mechanical Engineering

- Manufacturing Engineering

- Materials Engineering

- Semiconductor-related disciplines

Experience

- Minimum 5-8 years of experience in semiconductor assembly manufacturing or NPI engineering.

- Experience leading new product introductions and product transfers.

- Strong experience in assembly process development and qualification.

- Experience in high-volume semiconductor manufacturing environments.

Technical Knowledge

- Strong knowledge of semiconductor assembly processes.

- Understanding of:

Statistical Process Control (SPC)

- Design of Experiments (DOE)

- FMEA

- MSA

- 8D Problem Solving

- Root Cause Analysis

- Reliability Testing

- Process Qualification Methodologies

- Familiarity with automotive quality requirements such as IATF 16949 and APQP is an advantage.

Technical Skills

- Data analysis using Minitab, JMP, Excel, or equivalent tools.

- Yield improvement and defect reduction methodologies.

- Equipment qualification and process validation.

- Strong understanding of semiconductor package technologies.