Wire Bond & Die Attach Equipment Engineer (MES Project)

Change the world. Love your job.

Join TI as a specialized Equipment Engineer to drive the digital transformation of our Wire Bond and Die Attach lines. This is a unique, multi-phase role: following a 1 month TI orientation familiarizing with TI systems while being deployed into a critical MES implementation project team for 1–2 years. Upon successful project completion, you will transition into a production role, utilizing your deep MES expertise to optimize equipment uptime and automation in a high-volume manufacturing environment.

Key Responsibilities:

- MES Implementation (Project Phase): Represent equipment engineering in the MES rollout. Define equipment-specific workflows, setup/recipe controls, qualification requirements, and equipment states.

- Integration & Data: Translate physical shop-floor requirements into digital process designs. Define data collection needs and equipment interlocks to ensure seamless hardware-to-software communication.

- Validation: Validate equipment integration scenarios and lead User Acceptance Testing (UAT) and deployment on the production floor.

- Sustaining (Post-Project Phase): Transition to a production role to manage equipment reliability, troubleshoot MES-related equipment issues, and leverage your implementation knowledge to drive continuous improvement in automation and uptime.

Minimum Requirements:

- Minimum Education (Bachelor's degree Electrical Engineering, Electrical Computer Engineering, Chemical Engineering, Mechanical Engineering, Materials Science Engineering,) Physics or related engineering degree
- Strong hands-on semiconductor equipment experience in Wire Bond and/or Die Attach, with minimum 2 years of relevant experience

Preferred Qualifications:

- Equipment experience with ASM and KNS
- Candidate with MES experiences
- Experience on tool monitoring and interdiction software, and equipment maintenance and documentation
- Working knowledge of semiconductor manufacturing, and SPC techniques. Experienced with semiconductor cleanroom protocol and behaviors.
- Strong verbal and written communication skills
- Demonstrated strong analytical, critical thinking and problem solving skills
- Ability to work in teams and collaborate effectively with people in different functions
- Ability to take the initiative and drive for results
- Strong time management skills that enable on-time project delivery
- Ability to work effectively in an interrupt-driven, fast-paced and rapidly changing environment
- Demonstrated ability to build strong, influential relationship