About this role
Job Summary
We are seeking an accomplished R&D Scientist to lead Avient's innovation in next-generation thermoplastic materials for High Performance Computing (HPC), AI infrastructure, and hyperscale data center applications.
This technical leader will develop advanced low dielectric constant and ultra-low dielectric loss materials for high-speed connector systems operating at increasingly demanding data rates. The successful candidate will combine expertise in materials science, electrical performance, device physics, and advanced characterization to accelerate commercialization of breakthrough materials for next-generation computing architectures.
The ideal candidate will have deep knowledge of the relationship among material structure, processing, characterization of electrical performance for complex form-factors, with experience supporting high-speed connectors, semiconductor packaging, advanced interconnects, data communications, RF systems, or other signal integrity-critical technologies.
As part of Avient's Corporate Technology Innovation organization, this role will influence technology strategy, intellectual property development, customer engagement, and future growth platforms at the forefront of AI and digital infrastructure.
Education & Experience
Minimum Qualifications
- Ph.D. in Materials Science & Engineering, Polymer Science, Physics, Electrical Engineering, Chemical Engineering, or a closely related field.
- At least 5 years of industrial or advanced research experience developing materials for electronics, semiconductors, communications, or high-performance computing applications.
Preferred Qualifications
- 10+ years of experience in advanced materials development and commercialization.
- Demonstrated expertise in high-speed connectors, interconnects, semiconductor packaging, RF, microwave, or signal integrity applications.
- Proven record of patents, technical publications, and successful commercialization of new technologies.
- Experience collaborating directly with customers and external technology partners.
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