About this role
Job Summary: This role will be responsible for integration of optoelectronic components for advanced Co-Packaged Optics and Optical Engine products. This will include silicon photonics chip (PIC), electrical IC (EIC), control unit, organic substrate, and integration of lasers. Candidate will need to work with internal design and process teams, as well as external suppliers to ensure the final laser integrated CPO and Light Engine product meets performance specifications and bring products from concept to production with good yield and reliability.