External Package Innovation Engineer

Hiring: External Package Innovation Engineer

We are looking for a highly motivated engineer to drive external package innovation initiatives and collaborate closely with OSAT partners for successful project execution.

  Role Overview

As an  EPI engineer , you will act as both a  Role Owner  and  Key Supporter  for OSAT-related development activities, ensuring robust execution from concept through production.

  Key Responsibilities

✅  1. Role Owner (Strategic & Governance)

- Own and lead  OSAT-wide and cross-OSAT initiatives
- Define and deploy  standard development templates and success criteria  across OSATs
- Drive deployment of  Best Known Methods (BKM)  and lessons learned
- Develop and maintain  technology roadmap and capability assessment  for each OSAT site
- Provide  Package Innovation (PI) input  for: External site sourcing strategy
- Site selection process (jointly with interface manager)

- Lead  project governance , including: Overall project summaries
- Stoplight reporting
- Regular reviews per OSAT site

✅  2. Supporter (Execution & Project Delivery)

- Support  NPI & NTI projects  executed at external OSAT factories
- Ensure OSAT compliance with: Development processes
- Required documentation/templates

- Drive alignment on  SME (Subject Matter Expert) assignment  at OSAT
- Support and resolve  technical and project issues  on-site and across time zones
- Ensure  assembly readiness and safe production launch

  Stakeholder Collaboration

You will work closely with cross-functional teams, including:

- Project Leaders & Development Managers
- Designers & Materials Engineers
- Tech Integration & Modelling teams (Electrical, Mechanical, Thermal)
- API and WLP/PLP/FC SMEs
- OSAT partners

  What We’re Looking For

- Strong experience in  semiconductor packaging (especially with handson assembly process experience such as pre-assembly and wire bonding).  Previous exposure to OSAT ecosystem is an added advantage.
- Proven ability to manage  cross-site, cross-functional projects
- Solid understanding of  NPI/NTI development flows
- Excellent  stakeholder management and communication skills
- Ability to drive  standardization, governance, and technical problem-solving

  Why Join Us

- Opportunity to lead  high-impact package innovation initiatives
- Work with  global teams and OSAT partners for wide exposure and fast knowledge & skill growth
- Drive  technology roadmap and next-generation packaging solutions

More information about NXP in Malaysia...

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