About this role
What will your job look like?
- Work on thermal development of next-generation SoCs and air/liquid-cooled ECU platforms, covering product requirements, thermal architecture, design, simulation, characterization, testing and qualification.
- Perform detailed thermal performance assessment and CFD analysis of next-generation SoC/package designs, including die/package temperature distribution, heat spreading, thermal interfaces, material and stack-up optimization, and thermal resistance evaluation
- Develop and evaluate advanced cooling solutions, including air cooling, liquid cooling, heat pipes, and advanced heat-spreading technologies.
- Support vehicle-level cooling architecture and ECU integration for next-generation autonomous driving and Robotaxi platforms.
- Define cooling requirements including coolant temperature, flow rate, pressure drop, thermal interfaces, and system thermal margins.
- Correlate simulation results with laboratory and product measurements, drive thermal optimization and troubleshooting throughout development and qualification.
- Work closely with silicon Arch, package, HW, mechanical, electrical, validation, suppliers, Tier-1s and OEM customers.
All you need is:
- M.Sc. in Mechanical Engineering, Thermal Engineering, Aerospace Engineering, or a related field.
- 5+ years of relevant experience in thermal engineering for electronic systems, semiconductor packages, ECUs, or high-performance computing.
- Strong expertise in heat transfer, fluid mechanics, thermal management, and thermal/CFD simulation using dedicated thermal simulation tools such as Celsius EC, Icepak, FloTHERM or equivalent.
- Proven experience developing and validating air and/or liquid-cooling solutions for high-power electronics, with demonstrated experience taking products through qualification, NPI, and mass production.
- Demonstrated ability to independently lead complex technical activities across multiple engineering disciplines.
- Excellent technical communication skills in English.
Nice to have:
- Experience in semiconductor package thermal design and characterization.
- Background in automotive ECUs, high-performance compute platforms, and automotive qualification.
- Hands-on experience with advanced cooling technologies, including heat pipes, vapor chambers, and cold plates.
- Experience working with Tier-1 suppliers, OEMs, packaging houses, and thermal solution vendors.
Mobileye changes the way we drive, from preventing accidents to semi and fully autonomous vehicles. If you are an excellent, bright, hands-on person with a passion to make a difference come to lead the revolution!