ISP Program Manager

Tata Electronics Private LimitedAmerican SamoaOn-siteFull-timeStaff, 8–12 yearsListed 1 week ago

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About this role

Role Overview

The Program Manager – OSAT is responsible for leading large, complex customer programs from concept through high-volume manufacturing. This role serves as the single point of accountability for program execution—integrating customer requirements, engineering development, supply chain, and factory operations to ensure on-time, on-cost, and on-quality delivery.

A major focus of this position is operations readiness for new products (NPI to HVM transition), including capacity planning, qualification, ramp management, and alignment of cross-functional teams within an outsourced semiconductor assembly and test environment.

Key Responsibilities

Program Leadership & Execution

- Own end-to-end execution of multiple customer programs within the OSAT business unit.

- Act as the primary interface between customers and internal organizations (Technology Development, Factory NPI and Process Engineering, Operations/Manufacturing, Quality, Supply Chain, and Finance).

- Develop and maintain integrated program schedules, milestones, and deliverables.

- Drive structured program governance: stage gates, risk reviews, and executive reporting.

- Manage program financials including cost optimisation models, margins, and change management.

Customer Engagement

- Lead customer technical and business reviews, ensuring alignment on scope, schedule, and performance.

- Translate customer requirements into actionable internal plans.

- Manage customer escalations and ensure rapid issue resolution.

- Support commercial teams in RFQs, SOWs, and new business opportunities.

Operations Readiness & NPI

- Lead NPI to HVM transition activities including:

- Factory readiness (equipment, capacity, tooling, materials)

- Qualification planning (DOE, reliability, process validation)

- Yield ramp strategies and learning cycles

- Coordinate process development, product engineering, and manufacturing teams.

- Ensure BOM, process flows, test programs, and quality controls are production-ready.

Cross-Functional Coordination

- Chair core team meetings and drive accountability across functions.

- Manage risk registers, mitigation plans, and contingency strategies.

- Partner with Industrial Engineering on line design, cycle time, and capacity modeling.

- Align with Quality on customer qualifications, audits, and compliance.

Continuous Improvement

- Establish program management best practices, KPIs, and dashboards.

- Drive lessons-learned and standardization across programs.

- Support digitalization of program tracking and factory execution.

Required Qualifications

- Bachelor’s degree in Engineering (Electrical, Mechanical, Materials, Industrial) or related field.

- 15+ years of experience in semiconductor manufacturing, OSAT, or advanced packaging.

- Relevant years of experience in program/project management with direct customer ownership.

- Proven experience with:

- New Product Introduction (NPI) and HVM ramp

- Assembly & Test processes (wire bond, flip chip, WLCSP, BGA, SiP, etc.)

- Semiconductor quality systems (APQP, FMEA, Control Plans, 8D)

- Strong knowledge of:

- Manufacturing operations, capacity planning, and yield management

- Supply chain coordination and material readiness

- Cost modeling and program financial management

- Excellent stakeholder management and communication skills.

- Ability to influence cross-functional teams without direct authority.

Preferred Qualifications

- Master’s degree in Engineering, Operations, or MBA.

- Experience working directly in an OSAT or IDM ATM environment.

- PMP / PgMP / PRINCE2 certification.

- Hands-on background in:

- Package development and reliability qualification

- Test engineering and product bring-up

- Factory automation and MES systems

- Experience with Tier-1 global customers in mobile, automotive, HPC, or networking.

- Six Sigma Green/Black Belt certification.