About this role
External Manufacturing NPI Lead
- Bachelor's Degree in Engineering/ Materials Science or equivalent technical background
- More than 10 years of experience in backend semiconductor IC manufacturing environment, with in-depth assembly process expertise and shop floor experience
- Strong leadership with demonstrated project management skills across multi-stakeholder and cross-functional settings
- Hands-on assembly process experience in leading wafer technology such as SiC, GaN and CIS Imaging is highly desirable
- Prior experience in NPI, product/ process integration and familiar with Chip-to-Package Interaction (CPI) effect
- Experience in IC package design/ CAD/ simulation/ characterization will be advantageous
- Good overall understanding of OSAT business landscape and operations
- Adept at cross-functional collaboration, Adaptable to matrix organization, strong engineering fundamentals (including DOE characterization, SPC, failure analysis) and problem-solving skills
- Strong project management skills and multi-stakeholder management
- Proficient in statistical analysis methods and familiar with data analytics
- Good communication skills and proficient in written & spoken English. Spoken proficiency in Mandarin will be advantageous