About this role
As a Camera and Depth Electrical Engineer in the Reality Labs Devices team, you will work on camera, depth, and sensor electrical design, with the flexibility to contribute across customized ASIC, camera, depth, and sensor electrical module designs, as well as system integrations. You will have the opportunity to work across multiple product lines, including Mixed Reality (MR), Wearables (Smart glasses and Display), AI devices, and Robotics.
**What Impact You'll Make**
You will push the boundaries of consumer electronics by miniaturizing advanced imaging technology into ultra-lightweight wearable devices, immersive Mixed Reality experiences, next-generation AI devices, and robotics platforms. Your work will help solve the engineering challenge of integrating camera, depth, and sensor systems seamlessly into these products—balancing optical performance, form factor, and user experience. From enabling robots to perceive and navigate their environments to powering the spatial awareness in MR headsets and AI-driven devices, you are shaping how next-generation technology understands and interacts with the world.
**Who You'll Collaborate With**
The Camera Depth Sensor team owns camera, depth, and sensor development end-to-end, including sensor, ASIC, hardware designs (optical, mechanical, and electrical), architecture, characterization, process, and systems engineering. As an EE on the hardware design team, you will have direct collaboration with these teams within Camera Depth Sensor, as well as cross-functional partners, including the system EE team and TPM team. You will also partner with external manufacturing partners to develop and document design rules and capabilities.
**What Makes This Role Appealing**
This role offers cross-domain exposure spanning electrical, opto-mechanical, and optical disciplines while building evolving frameworks with visible impact. You will have the flexibility to work across multiple projects while focusing on module electrical engineering designs. The role allows you to apply your fundamental expertise—whether in analog, digital, chip design, system integration, or circuit design—to a variety of application levels. If you're excited by shaping how engineering knowledge scales, you'll thrive here.
Responsibilities
Responsible for the implementation and debugging of mixed-signal ASICs, board-level circuitry, high-speed signal integrity and systems used in our solutions
Develop novel solutions to complex electronics problems for Mixed Reality (MR), Wearables, AI devices, and Robotics applications
Deliver electrical designs from concept through prototyping, validation, and mass production
Apply industry-standard design, simulation, and analysis tools (e.g., Cadence, Altium, SPICE, MATLAB) to develop and verify electrical solutions
Collaborate with cross-functional partners, including electronics, image sensors, optics, mechanical engineering, firmware, and system electrical engineering teams, on seamless integration of camera and depth modules into Meta's Reality Labs' devices
Provide technical leadership in ASIC chip customization, driving architecture decisions and design optimization for camera and depth sensor applications
Assess vendors and manage outsourced development of PCBs
Lead debugging and failure analysis activities
Qualifications
Bachelor's degree in Electrical Engineering or equivalent experience in electronic hardware development
8+ years of experience in consumer electronics hardware development across product life cycles
Experience with low-power analog circuit design, DC/DC converters, power management methods, A/D and D/A conversion and image sensors
Experience designing electrical subsystems including power regulators, high-speed digital signal integrity (MIPI CPHY and MIPI DPHY), SOC and micro-controllers, serial-communication protocols (I2C, I3C, SPI, and LVDS)
Experience with schematic capture and PCB design using Cadence OrCAD/Allegro or equivalent
Experience with developing detailed test plans and performing electrical hardware validation
Experience with laboratory validation work including the ability to test/validate/debug completed reworks/assemblies/development platforms using oscilloscopes, frame grabber, optical sensor devices, logic analyzers, impedance analyzers, and similar
Experience using scripting languages like Matlab/Python for data analysis
Experience running firmware commands to drive prototype platforms
Experience in cross-functional collaboration Experience validating/verifying EE function blocks including custom ASICs
Experience adhering to and implementing responsible, ethical AI practices (e.g., risk assessment, bias mitigation, quality and accuracy reviews)
Consumer electronics experience and/or working within a mass-production environment
Experience developing modules or systems in high-volume consumer electronic products
Experience partnering with software or firmware teams to define and verify HW design maturity across test cases
Experience with laser driver or Camera and Depth sensor chip architectures
MS in Electrical Engineering or related fields
Experience with camera or depth sensor or auto-focus electrical design
Demonstrated ability to integrate AI tools to optimize/redesign workflows and drive measurable impact (e.g., efficiency gains, quality improvements)
Experience with end-to-end development of camera module electrical subsystem, system integration, and validation from the concept phase to mass production
8+ years of experience in consumer electronics hardware development across product life cycles
Experience working with PCB, FATP, Joint Development Manufacturer (JDM), Original Design Manufacturer (ODM), Contract Manufacturer (CM), Module Integrator (MI) partners
