About this role
We are looking for a skilled NPI Engineer (Assembly Packaging) to join our External Manufacturing team to drive our growing NPI/ NPD portfolio, especially new tactical engagements critical for onsemi's business growth. In this role, you will leverage your strong expertise and extensive technical network to drive new production introduction, develop new capability requirements, shape manufacturing strategies, and deliver advanced solutions for next-generation silicon technology and packaging solutions.
- Bachelor's Degree in Engineering/ Materials Science or equivalent technical background
- More than 10 years of experience in backend semiconductor IC manufacturing environment, with in-depth assembly process expertise and shop floor experience
- Hands-on experience in wafer-level packaging (WLP), bumping and post-fab solutions including electroless & electrolytic plating and other surface finishing technology will be advantageous
- Familiar with plating chemistry/ process and material/ metallurgy characterization & microstructural analysis
- Exposure to power device technologies (SiC, JFET, GaN, IGBT, Hybrid etc)
- Prior experience in NPI, product/ process integration and familiar with Chip-to-Package Interaction (CPI) effect
- Experience in IC package design/ CAD/ FEA simulation/ characterization will be advantageous
- Good overall understanding of OSAT business landscape and operations
- Adept at cross-functional collaboration, Adaptable to matrix organization, strong engineering fundamentals (including DOE characterization, SPC, failure analysis) and problem-solving skills
- Strong project management skills and multi-stakeholder management
- Proficient in statistical analysis methods and familiar with data analytics
- Good communication skills and proficient in written & spoken English. Spoken proficiency in Mandarin will be advantageous