About this role
Developing innovative technology solutions and bringing them to application - that is our goal at the Fraunhofer Institute for Photonic Microsystems IPMS .
Our »Center Nanoelectronic Technologies« (CNT) conducts research on 300 mm wafers for microchip manufacturers, suppliers, device manufacturers, and R&D partners. We offer process and technology developments as well as services at the ULSI (ultra-large-scale integration) level in the areas of front-end (FEoL) and back-end-of-line (BEoL) for various CMOS technology nodes.
The associated Interconnect Technologies group, which is part of our Neuropmorphic Computing business unit, focuses on technologies for metallization in the BEOL (back end of line) of CMOS manufacturing and the border area to advanced packaging. The core theme of the group is the creation of copper lines through electrochemical deposition (ECD) and chemical mechanical polishing (CMP), as well as all wet chemical cleaning steps.
Be part of change
- Research and development in the field of interconnect technologies
- BEOL process integration of existing UPD solutions to set up a complete BEOL metallization module
- Managing complex development projects in the field of metallization across different groups within the institute's division CNT
- Evaluation and potential development of novel metallization solutions
- Evaluation and responsibility for complex project ideas with regard to feasibility and the associated measures in the 300mm cleanroom
- Development of synergies between classic BEOL technologies and advanced packaging, in particular silicon interposer technologies
- Project management and acquisition for industrially and publicly funded projects
- Scientific exchange and presentation of research results at conferences and participation in workshops