About this role
Die Bond Process Technician is responsible for operating, setting up, and maintaining die attach equipment to ensure accurate and reliable placement of semiconductor dies onto leadframes or substrates. The role requires fundamental knowledge of die attach processes, materials (epoxy, eutectic, solder), and machine principles such as vacuum, temperature, force, and precise alignment (X‑Y‑θ). The technician performs routine inspections, monitors process stability using basic SPC methods, and identifies common defects like die shift, tilt, and voids. They are also responsible for basic troubleshooting of machine alarms, executing recovery actions, and escalating complex issues when required. Adherence to work instructions, safety standards, ESD control, and cleanroom protocols is essential. The position demands strong discipline, attention to detail, effective communication, and the ability to work in a high-volume, shift-based manufacturing environment while supporting continuous improvement in quality and productivity.
- Diploma in any relevant discipline.
- Familiarity with high tech or semiconductor industry will be a plus, but not a mandate.
- 5+ years’ experience relevant experience in Die bond process.
- Problem-solving mindset with a willingness to roll-up sleeves and get the job done.
- Results-driven mindset with strong analytical skills and demonstrated success working with cross-functional stakeholders
- Robust knowledge of Microsoft Office applications including Excel, PowerPoint, Word