About this role
Technical and customer support for the qualification of SiC die sales and development. The candidate must have knowledge of package design, assembly processes and interactions with device.
- MS Degree in Material Science, Chemical Engineering, Semiconductor Processes or other relevant technical field.
- Strong communication skills.
- Ability to lead development projects and implement strategies on a global basis.
- Knowledge of post fab processing such as wafer thinning, sputter, electroplating, electroless plating, photolithography, wafer bonding. Knowledge of wafer level packaging, package assembly and component processes such as: wirebond, sintering, die attach, clip attach, reflow, molding.
- Knowledge of materials and material interactions.
- Strong English conversational skills.