ISP Line Quality Technician

Position Overview:

The Line Quality Technician operates within a semiconductor IC backend manufacturing and packaging environment and is responsible for in‑process and end‑of‑line quality control activities on the production line .
The role focuses on ensuring product quality across IC assembly, packaging, and singulation processes by performing inspections, identifying non‑conformances, and supporting corrective actions in real time.

Responsibilities:

- Perform in‑process and end‑of‑line quality control inspections at various stages of semiconductor packaging production.

- Execute inspections on the production line to identify defects and deviations from defined process and quality requirements.

- Follow established quality control procedures to detect product and process non‑conformances.

- Collaborate with cross‑functional teams (production, engineering, quality) to address and resolve quality issues promptly.

- Conduct statistical analysis and root cause analysis to identify defect trends and improvement opportunities.

- Monitor and evaluate line processes to ensure compliance with industry standards, customer requirements, and internal specifications.

- Implement and maintain quality documentation , including inspection results and control records.

- Work closely with production line teams to provide real‑time feedback and support continuous improvement initiatives.

- Conduct line audits to verify adherence to quality control protocols and procedures.

- Provide training and guidance to production personnel on quality control practices and inspection standards.

- Support cross‑functional collaboration to integrate quality controls into new product or package introductions .

Qualifications:

- Bachelor’s degree or Diploma in Mechanical Engineering, Electrical Engineering, Materials Science , or a related field.

- Hands‑on experience with quality control tools (SPC, FMEA, MSA, 8D, 7QC tools).

- Minimum 3 years of relevant experience in the semiconductor industry , with exposure to:

- Plasma cleaning

- Molding

- Laser marking

- Saw / Punch singulation

- Plating and buffing

- AOI

- Pick & Place inspection

- Experience performing Laser marking FAI , package dimension measurement , wettability checks , and AOI defect assessment .

- Strong knowledge of ISO 9001 and IATF 16949 standards.

- Familiarity with statistical tools such as JMP or Minitab.

- In‑depth knowledge of IC packaging and backend processes .