Hardware Systems Integration Engineer, Foldable

Google's mission is to organize the world's information and make it universally accessible and useful. Our Devices & Services team combines the best of Google AI, Software, and Hardware to create radically helpful experiences for users. We research, design, and develop new technologies and hardware to make our user's interaction with computing faster, seamless, and more powerful. Whether finding new ways to capture and sense the world around us, advancing form factors, or improving interaction methods, the Devices & Services team is making people's lives better through technology.

Minimum qualifications:

- Bachelor’s degree in Electrical Engineering, Computer Engineering, Physics, a related field, or equivalent practical experience.

- 4 years of experience implementing product development lifecycles for mass-production hardware designs.

Preferred qualifications:

- Master's or PhD degree in Electrical Engineering, Computer Engineering, Physics, or a related field.

- 7 years of experience implementing product development lifecycles for mass-production hardware designs.

- 1 year of experience in technical leadership.

- Experience working with IP, SoC and platform design teams on the definition of power delivery network.

- Experience with high speed design and system power charging at chipset, baseband, and system architecture.

- Design, develop, and review phone hardware systems and sub-components from concept to mass production.

- Design and execute comprehensive system integration stress tests to identify edge cases and validate hardware reliability to mass production.

- Participate in all stages of next generation consumer product development.

- Develop the design process to optimize Printed Circuit Board (PCB) design, including circuit and layout designs for high-speed signal Flexible Printed Circuits (FPCs) and connectors, optimize advanced charging technologies, and perform rigorous charging and thermal Critical User Journey (CUJ) tuning and system optimization.

- Lead complex system integration by driving the electrical integration of phone architecture to resolve unprecedented thermal, Power Delivery Network (PDN), and packaging bottlenecks within an ultra-constrained thickness.