Engineer II-Equipment

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Job Description:

The Panelization Engineer II is responsible for developing, optimizing, and sustaining panel-level assembly processes including Die Attach, Chip Attach, Screen Printing, Plasma Treatment, Die Matrix Expansion, and Carrier Lamination operations. The role focuses on achieving high-quality manufacturing performance through process control, yield improvement, cost reduction, equipment optimization, and continuous improvement initiatives while ensuring compliance with customer, quality, and safety requirements.

Equipment Maintenance & Troubleshooting

Process Development and Optimization

- Develop, qualify, and optimize panelization processes for advanced semiconductor package manufacturing.
- Establish and maintain robust process parameters for: Die Attach
- Chip Attach
- Screen Printing
- Plasma Cleaning/Treatment
- Die Matrix Expander
- Carrier Laminator

- Conduct Design of Experiments (DOE) to improve process capability, yield, and throughput.
- Implement process controls and monitor critical process parameters (CPPs) and key performance indicators (KPIs).
- Support new product introductions (NPI) and technology transfers into manufacturing.

Manufacturing Support

- Provide day-to-day engineering support to production operations.
- Troubleshoot process-related issues and implement corrective and preventive actions (CAPA).
- Drive disposition and resolution of process excursions, non-conformances, and customer complaints.
- Collaborate with Production, Maintenance, Quality, and Product Engineering teams to ensure smooth manufacturing operations.

Equipment and Technology Management

- Support qualification, installation, and release of new process equipment.
- Develop equipment specifications and acceptance criteria.
- Coordinate preventive maintenance strategies and equipment capability improvements.
- Monitor machine performance metrics such as uptime, Overall Equipment Effectiveness (OEE), and process stability.

Yield and Quality Management

- Analyze manufacturing data using statistical tools to identify yield loss mechanisms.
- Drive continuous improvement projects focused on:

- Yield enhancement
- Defect reduction
- Cycle time improvement
- Cost reduction
- Apply SPC, FMEA, GR&R, 8D, and other quality methodologies.
- Ensure compliance with customer specifications, industry standards, and internal quality requirements.

Requirements/Qualifications:

Minimum Bachelor's Degree in:

Electronics Engineering

Mechanical Engineering

Manufacturing Engineering

Materials Science Engineering

Chemical Engineering

Related Engineering Discipline

- 3+yrs of work experience in Equipment Engineering from Semiconductor or any equivalent industries.
- Strong knowledge of semiconductor equipment systems (mechanical, electrical, PLC, sensors, robotics).
- Basic understanding of statistical process control (SPC) and FMEA
- Strong analytical and problem-solving skills; ability to interpret SPC charts and process data.
- Good communication skills and ability to work in a team-oriented environment.
- Knowledge of safety protocols in chemical handling and cleanroom practices.
- Minimum 5–8 years of experience in semiconductor manufacturing equipment support.
- Strong experience with WLCSP or advanced packaging tools is highly preferred
- Experience with troubleshooting automation systems and control software.
- Ability to read technical schematics, manuals, and electrical diagrams.
- Proficiency in MS Office and maintenance management systems (CMMS is an advantage).
- Strong analytical and problem-solving skills

Travel Time:

0% - 25%

To all recruitment agencies : Microchip Technology Inc. does not accept unsolicited agency resumes. Please do not forward resumes to our recruiting team or other Microchip employees. Microchip is not responsible for any fees related to unsolicited resumes.