Engineer II Device

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Job Description:

STEP R&D Department Description

The STEP (Strategic Technical Enablement Partnership) and R&D department is part of Microchip’s global front-end of line wafer fabrication organization. The team is in charge of technology transfers, technology enhancements, and process and device development projects running in internal and foundry wafer FAB’s .

Our team work across multiple locations, providing multi geographical R&D and technology support to the different business units.

Device Engineer description & objectives

Reporting to a STEP and R&D manager in Rousset you will collaborate with team members in France and in the United States (Reading, Tempe & San Jose).

As a device engineer, you will contribute to technology transfer, enhancement, and development projects, focusing on BCD MOS technologies.

Your responsibilities will include:

·       Work with Design, Fab and Product Engineering teams to drive yield improvement, and circuit optimization, and device performance enhancement, especially on BCD MOS technology.

·       Analyze electrical characterization data from DOE and corner lots to support optimization and validation.

·       Support device characterizations, bench measurements, analyses and TCAD simulations.

·       Define and draw new test key structures to evaluate layout-driven optimizations for the different technology enhancement projects.

·       Run design/layout and process experiments for optimum semiconductor device performance.

·       Use various troubleshooting techniques to isolate and solve technical issues with devices and processes.

·       Work with failure analysis groups on field failures and customer returns to quickly isolate the problem and implement corrections.

·       Present data, results, and conclusions in the technical team meeting.

What’s attractive about this opportunity?

-  This position will strengthen your technical expertise through hands-on technology enhancement, device characterization, and process optimization.

-  You will have the opportunity to work in an international team covering multiple aspects of the semiconductor industry.

Requirements/Qualifications:

·       Strong knowledge of microelectronics, including Wafer Fabrication, Device Physics and TCAD simulations (Sentaurus).

·       Familiar with Unix environment and with Cadence tools.

·       Self-motivated, proactive, good communication and teamwork skills.

·       Fluent verbal and written communication skills in English and French.

The New College Grade (NCG) candidate (less than 3 years of experience) must have a master’s degree or PhD with major emphasis on Semiconductor Devices.

Travel Time:

0% - 25%

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