About this role
1. Advanced Technology & Architecture Development: Lead feasibility assessment and development of advanced packaging technologies for wafer-level and panel-level applications, including 2.5D/3D/3.5D integration and Fan-out packaging.
2. New Product Introduction (NPI) & Mass Production Improvement: Plan pilot production processes, design and execute DOE (Design of Experiments), lead yield analysis and engineering issue resolution, and drive yield improvement for mass production.
3. Application-Specific Packaging Solutions: Develop packaging solutions for logic and high-bandwidth memory integration, including HBM and LPDDR.
4. Supply Chain & Outsourced Manufacturing Management: Manage technical collaboration with wafer foundries, OSATs, and substrate suppliers, including technical evaluation, cost structure analysis, and production line audits.
5. Cross-Functional Project Leadership: Lead cross-functional collaboration across IC design, layout, testing, quality assurance, and reliability teams to ensure projects meet technical targets and schedule requirements.
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