About this role
Lead the development and qualification of advanced multi-Phase Power Module, DrMOS, and Smart Power Stage (SPS) packages. Responsible for package architecture, substrate design, flip-chip integration, passive component assembly, reliability qualification, and manufacturing readiness. Collaborate closely with Product Engineering, Silicon Design, Reliability, Operations, OSATs, and suppliers to deliver high-performance, cost-effective power packaging solutions.
- BS/MS in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.
- 10+ years of semiconductor package development experience.
- Strong expertise in:
Multi-Phase Power Modules, DrMOS, and SPS packaging
- Advanced substrate design and manufacturing
- Flip-chip assembly and package integration
- Passive component assembly and optimization
- Thermal management and reliability engineering
- High-volume manufacturing and NPI processes
- Experience working with OSATs, substrate suppliers, and material vendors.
- Strong communication skills, with the ability to effectively collaborate with Business Units, cross-functional teams, internal and external manufacturing partners, and customers.
- Proficiency in engineering tools and methodologies, including ACAD, 8D, SPC, DFMEA, DOE.
- Proven ability to lead projects across organizations and cultures in a fast-paced environment.