About this role
• Previous experience in MOSFET technologies and SiC plus.
• Thorough understanding of semiconductor fabrication processes and device physics, product testing, performance and reliability.
• Strong self-motivated, initiative and integration mind.
• Good communication and presentation skills (Proficient at technical writing and presenting)
Qualification & Requirement
• BS or MS in Electrical Engineering or related technical field (example: Chemical, Mechanical, Physics)
• Less than 6 years of direct fab yield experience, preferably in Integration Engineering or Product Engineering.
• Proven record of product engineering leadership resulting in quantifiable improvements in quality, yield, cost or process.
• Ability to identify, collect, analyze and present data necessary to resolve yield related issues based on silicon technical skills
• Ability to adapt to changes in the work environment, delays or unexpected events; manage competing demands; change approach or method to best fit the situation to ensure site success
Below skills and experiences are preferred
• Previous experience in MOSFET/IGBT technologies and SiC plus.
• Thorough understanding of semiconductor fabrication processes and device physics, product testing, performance and reliability.
• Strong self-motivated, initiative and integration mind.
• Good communication and presentation skills (Proficient at technical writing and presenting)
Same Posting Description for Internal and External Candidates