Assembly Process Engineer

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology Inc.

People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip’s nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values ; we affectionately refer to it as the Aggregate System and it’s won us countless awards for diversity and workplace excellence.

Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you.

Visit our careers page to see what exciting opportunities and company perks await!

Job Description:

Assembly Process Engineer is responsible for developing, setting up, optimizing, and sustaining Flip Chip BGA assembly processes, with primary focus on Heat Spreader Attachment and Ball Attachment processes. The role includes machine setup, process setup, process evaluation, yield improvement, defect reduction, and supporting high-volume manufacturing operations. The engineer will work closely with production, quality, equipment, and product engineering teams to ensure stable and reliable assembly performance.

Requirements/Qualifications:

Requirements

- Bachelor’s Degree in any Engineering related field
- Minimum 2–5 years of semiconductor assembly process engineering experience.
- Experience in Flip Chip BGA package assembly processes.
- Knowledge of semiconductor assembly materials and process interactions.
- Experience with DOE, SPC, PFMEA, 8D, and root cause analysis methodologies.
- Ability to interpret engineering drawings, process specifications, and technical documentation.
- Familiarity with assembly equipment used in: DispensingPlacementReflowBall mountingInspection systems
- Good troubleshooting and analytical skills.
- Strong communication and cross-functional collaboration skills.

Travel Time:

0% - 25%

To all recruitment agencies : Microchip Technology Inc. does not accept unsolicited agency resumes. Please do not forward resumes to our recruiting team or other Microchip employees. Microchip is not responsible for any fees related to unsolicited resumes.