About this role
Summary
We are looking for a highly skilled SMT professional with strong electronics background to coordinate and manage programs related to AOI, SPI, Pick & Place (P&P), Reflow/Profile, X-ray inspection, and End-of-Line (EOL) rework activities. The role requires deep expertise in SMT processes, machine programming, defect analysis, and cross-functional coordination to ensure high-quality production output.
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Key Responsibilities
Program Coordination
- Coordinate complete SMT program setup and validation including: AOI (Automated Optical Inspection)
- SPI (Solder Paste Inspection)
- Pick & Place machines
- Reflow oven profiling
- X-ray inspection programs
- Ensure smooth program releases from NPI to mass production.
- Maintain version control and optimization of machine programs.
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Process Engineering & Optimization
- Develop, validate, and optimize SMT process parameters.
- Perform solder paste, stencil, and component placement optimization.
- Define and monitor reflow profiles for different PCB assemblies.
- Troubleshoot process issues and improve first-pass yield (FPY).
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Inspection & Quality Control
- Create and fine-tune AOI & SPI inspection criteria and libraries.
- Develop X-ray inspection standards for BGA/QFN and critical components.
- Analyze defects such as: Solder bridges
- Insufficient/excess solder
- Component misalignment
- Voids and hidden defects
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EOL Rework Coordination
- Coordinate End-of-Line (EOL) rework activities.
- Analyze failure modes and root causes.
- Guide rework technicians for complex repairs (BGA, fine-pitch, etc.).
- Ensure rework quality meets IPC standards.
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NPI & Documentation
- Support New Product Introduction (NPI) builds.
- Prepare and maintain: Work instructions (WI)
- SOPs
- Process flow documents
- Conduct risk assessments and DFx (Design for Manufacturability).
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Cross-functional Coordination
- Liaise with production, quality, maintenance, and design teams.
- Support customer requirements and audits.
- Ensure compliance with IPC, ISO, and customer quality standards.
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Requirements
Required Skills & Competencies
- Strong knowledge of SMT processes and electronics assembly.
- Hands-on experience with: AOI, SPI, P&P programming
- Reflow profiling tools
- X-ray inspection systems
- Expertise in defect analysis and root cause methodologies (8D, Fishbone, etc.).
- Good understanding of PCB design and electronic components.
- Familiarity with IPC standards (IPC-A-610, IPC-7711/7721).
- Strong analytical and problem-solving skills.
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Educational Qualification
- Bachelor’s / Diploma in: Electronics Engineering
- Electrical Engineering
- Instrumentation or related field
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Experience
- Minimum 5–10 years of experience in SMT/EMS industry.
- Proven experience in program coordination and process engineering.
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Preferred Skills
- Experience in high-mix, high-volume production environments.
- Knowledge of MES systems and Industry 4.0 tools.
- Six Sigma / Lean Manufacturing exposure is an advantage.
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Key Performance Indicators (KPIs)
- First Pass Yield (FPY)
- Defect per Million Opportunities (DPMO)
- Reduction in rework/rejection rates
- Program stability and downtime reduction