About this role
MediaTek’s advanced memory design team in San Jose, CA is seeking a highly experienced memory design engineer to architect and define memory circuits. This role focuses on high-performance compute (HPC) ASIC solutions for Data Center AI and Networking, as well as designing energy efficient edge AI Accelerators.
• Work in close partnership with leading Data Center AI ASIC customers in North America to co-develop embedded memory architectures and circuits on advanced technology nodes.
• Collaborate with product engineering, technology development and architecture teams to define, design, and deliver high-performance, customized semiconductor memory solutions — including SRAM, TCAM, Compute-In-Memory (CIM), and Near Memory Compute (NMC) macros — tailored to diverse PPA requirements for Data Center AI, Networking, and Edge AI applications.
• Lead Design Technology Co-Optimization (DTCO) and pathfinding initiatives for semi-custom and custom SRAM designs.
• Lead the end-to-end design of dual-rail custom memories, ensuring all customer performance, power, and area (PPA) specifications are fully satisfied.
• Drive innovation by designing and integrating specialized circuits and features to achieve industry-leading PPA in both custom and compiler-generated memories.
• Provide mentorship and technical direction to other designers, while remaining hands-on in digital circuit design with a focus on memory architectures.
• Evaluate and implement new design methodologies and tools to enhance productivity and quality.
• Demonstrate strong organizational skills and the ability to work independently, effectively managing multiple tasks, and collaborating with global design and CAD teams.