Test & Plating Process Engineer (MES Project)

Texas InstrumentsKuala Lumpur, Kuala LumpurOn-siteFull-timeMid level, 2–5 yearsListed 11 hours ago

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About this role

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Texas Instruments is seeking a Process Engineer to lead the digital design of our Test & Plating manufacturing processes. This is a unique, multi-phase role: following a 1 month TI orientation familiarizing with TI systems while being deployed into a critical MES implementation project team for 1–2 years. Once the system is live, you will return to a production role, using your knowledge of digital process controls to drive yield and efficiency.

Key Responsibilities:

- MES Implementation (Project Phase): Drive manufacturing process design within the MES. Define process flows, routing, material handling, and traceability.

- Control & Exception Handling: Design the digital logic for process controls and exception handling, including automated holds, rework loops, and material disposition.

- Alignment & Validation: Align requirements between manufacturing and quality teams. Validate proposed digital workflows and support UAT and deployment.

- Sustaining (Post-Project Phase): Transition to a production role to manage process stability, use MES data for yield enhancement, and optimize process parameters (e.g., wedge bonding optimization) through the new digital framework.

Minimum requirements:

- Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field
- Strong hands-on semiconductor process experience in Test & Plating, with minimum 2 years of relevant experience
- Strong foundation in statistical process control, engineering change control and process release strategies

Preferred qualifications:

- Experience working with MES platforms , whether Siemens OpCenter or another comparable MES product modeling or configuration
- Working awareness of PAC-related integration and adjacent automation flows, sufficient to identify cross-system impacts and escalate early
- Experience in optimizing process parameters for wedge bonding or die attach accuracy.
- Demonstrated strong analytical and problem solving skills
- Strong verbal and written communication skills
- Ability to work in teams and collaborate effectively with people in different functions
- Strong time management skills that enable on-time project delivery
- Demonstrated ability to build strong, influential relationships
- Ability to work effectively in a fast-paced and rapidly changing environment
- Ability to take the initiative and drive for result