About this role
Preferred
- Master of Science degree in related discipline with background in electronic packaging, chip package designs and/or chip cooling solution.
- Prior experience in electronic packaging industry and/or chip design industry
- Established relationships within OSATs, ODMs and/or chip vendors
Skills & Attributes
- Highly analytical and strategic thinker with quality and reliability of product in mind
- Skilled in DFx (x = manufacturability, reliability, and/or test)
- Comfortable in operating with ambiguity in fast‑evolving technology markets
- Excellent communication skills in English; Mandarin proficiency strongly preferred
Our Commitment to a Culture of Inclusion & Belonging
Ecolab is committed to fair and equal treatment of associates and applicants and furthering the principles of Equal Opportunity to Employment. We will recruit, hire, promote, transfer and provide opportunities for advancement based on individual qualifications and job performance in all matters affecting employment, compensation, benefits, working conditions, and opportunities for advancement. Ecolab will not discriminate against any associate or applicant for employment because of race, religion, color, creed, national origin,citizenship status, sex, sexual orientation, gender identity and expressions, genetic information, marital status, age, or disability.