About this role
Preferred
- Master of Science degree in related discipline with background in electronic packaging, chip package designs and/or chip cooling solution.
- Prior experience in electronic packaging industry and/or chip design industry
- Established relationships within OSATs, ODMs and/or chip vendors
Skills & Attributes
- Highly analytical and strategic thinker with quality and reliability of product in mind
- Skilled in DFx (x = manufacturability, reliability, and/or test)
- Comfortable in operating with ambiguity in fast‑evolving technology markets
- Excellent communication skills in English; Mandarin proficiency strongly preferred