Package Design/Technology/Layout Engineer

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Google's mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of Google AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.

Minimum qualifications:

- Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.

- 1 year of experience with semiconductor package design and substrate layout.

- Experience with industry-standard packaging EDA tools such as Cadence APD/APD+, Cadence Allegro, or Siemens/Mentor Xpedition.

Preferred qualifications:

- Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.

- Strong understanding of substrate manufacturing processes, materials, and design rules.

- Proven track record of taping out high-pin-count, high-speed flip-chip packages.

- Drive the physical layout of high-performance package substrates, from initial bump/ball map feasibility and pin-out optimization to final Gerber/GDS release.

- Design and layout complex 2.5D/3D architectures, including flip-chip BGA (FCBGA), Silicon Interposers (CoWoS).

- Partner with SoC designers and System board engineers to co-optimize die-to-package and package-to-board interconnects, and work intimately with Signal and Power Integrity teams to optimize trace routing, decoupling capacitor placement, and power plane geometries to meet electrical targets.

- Interface with leading foundries and OSATs to evaluate new packaging technologies, establish Design Rule Checks (DRC), and influence future package technology roadmaps, and develop scripts and CAD methodologies to automate tedious layout tasks, improve design quality, and shorten cycle times.