About this role
onsemi is currently seeking an experienced Process Engineer to support and optimize wafer bumping & DPS manufacturing processes for high-volume semiconductor production. The successful candidate will be responsible for process development, process characterization, yield improvement, defect reduction, equipment qualification, and manufacturing support while ensuring compliance with quality and reliability requirements. Relevant bumping experience may include UBM, photolithography, plating, reflow, wafer thinning, WLCSP, Cu pillar, solder bump, micro-bump, or advanced packaging technologies.
· Bachelor's Degree or higher in:
- Electrical Engineering
- Electronic Engineering
- Materials Science
- Chemical Engineering
- Mechanical Engineering
- Semiconductor Engineering
· Minimum 5 years of semiconductor manufacturing experience.
· Minimum 3 years of direct wafer bumping process experience.
· Strong knowledge of:
- Solder bump technology
- Cu pillar bumping
- WLCSP
- UBM process
- Electroplating
- Reflow process
· Experience in high-volume semiconductor manufacturing environment.
· Strong understanding of SPC, MSA, FMEA, Control Plan, 8D, and DOE methodologies.
· Hands-on experience in process troubleshooting and yield improvement.
· Proficient in statistical data analysis tools such as JMP, Minitab, or equivalent.
· Familiar with semiconductor quality standards and customer qualification requirements.