About this role
Shape the future of semiconductor packaging for AI and High-Performance Computing.
We’re looking for a Senior Staff Engineer to develop next-generation package concepts for AI power-supply and HPC applications . You’ll lead package definition from concept to product release, working across Back-End assembly, OSAT partners, simulation, reliability, SMT and module technologies .
If you bring deep expertise in semiconductor packaging and assembly and want to turn innovative concepts into high-performance solutions, this could be your next opportunity.
Your role Key responsibilities in your new role
- Develop and define package concepts for AI power-supply products , with an emphasis on High-Performance Computing (HPC) modules .
- Validate proposed package concepts through simulation and hardware demonstrators , working closely with Back-End development , product development , and system architects .
- Coordinate and align new package concepts with Back-End development teams , including internal teams and OSAT partners , and launch required assembly projects .
- Track and support package development projects through to final product release .
- Identify emerging development needs and translate them into additions or updates to the package roadmap .
- Serve as the technical point of contact for customer questions related to semiconductor packaging .
- Stay current on packaging solutions by continuously monitoring market trends and conducting competitor benchmarking .
- Identify and assess business opportunities created by new technologies and innovative packaging concepts .
- Lead the technical definition for major and new package projects , including BOM , package design , assembly technology selection , PRP reviews , and project classification , as well as risk and impact assessment .
- Define package characteristics that satisfy electrical, thermal, mechanical, and reliability requirements .
- Act as a key technical interface to partners and technical consultants on package definition , particularly in Back-End assembly technology .
- Support pre-development and project definition activities , and serve as the packaging design expert throughout the full project lifecycle .
Your profile
Qualifications and skills to help you succeed
- Bachelor’s degree in Engineering (e.g., Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, or Applied Physics) with ~7+ years of relevant experience in assembly technologies.
- Strong hands-on knowledge of Back-End processes, materials, and interdependencies (including laminate design, materials, and manufacturing processes).
- Working knowledge of SMT, PCB/module-related technologies and Mechanical
- Additional knowledge of passive components, including MLCCs, is an advantage.
- Expertise in semiconductor packaging, assembly, and test.
- Experience with failure analysis and reliability engineering.
- Strong analytical, statistical ( JMP, Minitab), and structured problem-solving skills.
- AutoCAD and 3D drafting skills preferred.
- Excellent communication and presentation skills, must be able to communicate effectively English both verbally and in writing.
#WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone.
We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.
Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.
Please let your recruiter know if you need any accommodations during the interview process.
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Mandy Neoh