Packaging Engineer - Inductor and Power module

The Emerging Packaging Technologies at Texas Instruments is looking for a candidate for Inductor and Power module development engineer

Responsibilities:

- Design and develop ultra-compact, high-density, high current (100–300A) power delivery modules targeting enterprise and AI infrastructure applications.

- Understand market trends and end equipment system requirements and translate these into package design specifications.

- Work with magnetic material and component suppliers to evaluate and qualify materials, inductors, and capacitors that meet performance, reliability, and scaling requirements.

- Ensure manufacturability, testability, and reliability through evaluation, material qualification, and supplier collaboration.

- Collaborate with cross-functional teams across sites to support development schedules and time-to-market targets.

Minimum Qualifications:

- MS degree in Electrical Engineering, Materials Science, or related field with focus on magnetics and power packaging.

- 5+ years of hands-on experience in inductor design or package development.

- Working knowledge of power delivery architectures, thermal management, EMI, and reliability constraints.

- Good understanding of magnetic material types.

- Familiarity with material characterization techniques (BH analyzer, VSM, SEM, EDX).

- Understanding of material processing for ceramic, metal powder, and composite materials.

- Familiarity with inductor coil forming and termination processes: wire wound, multilayer, metal composite, thin film, etc.

- Good communication skills; able to work effectively with internal teams and external suppliers.

- Proficiency in English and Japanese.

Preferred Qualifications:

- Hands-on experience with simulation tools such as Maxwell, Ansys, or Femtet; familiarity with homogenization, model order reduction, and optimization techniques (NN, AI/ML a plus).

- Prior contributions to patents or publications in magnetics, packaging, or passive integration.

- Familiarity with magnetic supplier capabilities and emerging research directions.