Lead Reliability Engineer, Advanced Packaging

We are seeking a highly skilled Lead Reliability Engineer to join as the reliability architect for complex power-module and advanced-packaging platforms. This role will lead reliability strategy from concept through qualification and product release, translating customer use conditions and mission profiles into design-for-reliability requirements, characterization plans, and qualification strategies.

Minimum requirements:

Bachelor's degree in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, or a related technical field; Master's degree or PhD preferred.

8+ years of relevant experience in semiconductor, power-electronics, packaging, or product reliability, including leadership of complex qualification or reliability programs.

Demonstrated experience with die- and package-level reliability, advanced packaging, power modules, and associated failure mechanisms.

Strong knowledge of reliability test methods, acceleration principles, qualification planning, and industry standards such as JEDEC, AEC-Q, and AQG 324, as applicable.

Experience translating customer use conditions or system mission profiles into reliability requirements and validation plans.

Working knowledge of statistical analysis and reliability methods using JMP, ReliaSoft, Minitab, Python, or equivalent tools.

Experience leading cross-functional problem solving, failure analysis, root-cause investigations, corrective actions, and technical risk assessments.

Excellent written and verbal communication skills, including the ability to present complex technical topics, qualification status, and risk trade-offs to customers and executive stakeholders.

Demonstrated ability to manage multiple priorities and deliver high-quality results in a fast-paced development environment.

Ability to travel within the United States and internationally, as required.

Preferred qualifications:

Experience with high-power semiconductor devices and modules, including Si, IGBT, SiC, or GaN technologies.

Experience with thermal-mechanical reliability, interconnect reliability, power cycling, temperature cycling, humidity-bias testing, and lifetime modeling.

Experience supporting automotive or industrial customers and working within structured product-development and change-control processes.

Experience developing new test methods or test vehicles where existing industry-standard methods are insufficient.