Assembly Quality Engineer

Job Summary:

onsemi is looking for an Assembly Quality Engineer who is responsible for ensuring product quality, process stability, and continuous improvement across Front of Line (FOL) semiconductor assembly operations, including Wafer Saw, Die Attach/Die Bond, and Wire Bond processes. This role drives defect prevention, yield improvement, customer satisfaction, and compliance with quality management system requirements through data analysis, problem-solving, process audits, and collaboration with cross-functional teams.

Requirements

- Bachelor's Degree in Engineering (Electronics, Electrical, Mechanical, Industrial, Materials Science, or related discipline).

- Minimum 5 years of experience in semiconductor assembly manufacturing and quality engineering.

- Strong knowledge of Front of Line assembly processes including Wafer Saw, Die Attach/Die Bond, and Wire Bond.

- Experience in semiconductor quality tools and methodologies such as SPC, FMEA, MSA, Control Plans, DOE, CAPA, and Root Cause Analysis.

- Working knowledge of semiconductor package construction, assembly materials, and reliability requirements.

- Experience in interpreting engineering drawings, specifications, and process standards.

- Strong analytical, troubleshooting, and data interpretation skills.

- Proficiency in quality reporting and statistical analysis tools (Minitab, JMP, Excel, Power BI, or equivalent).

- Excellent communication and cross-functional collaboration skills.

Preferred Skills

- Experience supporting automotive semiconductor products and IATF 16949 requirements.

- Knowledge of Lean Manufacturing and Six Sigma methodologies (Green Belt Six Sigma is an advantage).

- Familiarity with Backend process and semiconductor reliability testing.