About this role
*Execute interposer tapeout end-to-end using 3DICC (3D IC Compiler) as the primary design and integration tool.
*Drive 3D IC / interposer physical design — develop/maintain D2D routing and PDN flows, and execute project implementation to tapeout.
*Manage interposer-level DRC/LVS signoff using Calibre, including rule deck setup, violation debugging, and final signoff closure.
*Collaborate closely with foundry & OSAT teams to resolve interposer design rule issues.
*Document tapeout procedures, identify flow bottlenecks, and drive continuous improvements for interposer projects.