About this role
This position, based in the Philippines, is responsible for driving continuous improvement in package quality, manufacturing processes, operational efficiency, and system robustness at external subcontractors for ON Semiconductor (Onsemi). This requires close collaboration with internal stakeholders and subcontractor teams to execute the following responsibilities:
Qualifications
- Bachelor’s degree in engineering.
- Minimum of 12 years of experience in semiconductor assembly, with a focus on Process or Quality Engineering for automotive-grade products. (Power IC is plus)
- Positive and proactive attitude toward challenges and continuous learning for all critical issues.
- Willingness and ability to work onsite at subcontractor locations.
- Demonstrated leadership in troubleshooting and structured problem-solving (e.g., 8D, Is-Is Not, 3-5 Why).
- Certifications in VDA or IATF16949 are highly preferred.
- Excellent communication skills in English, with the ability to engage effectively with global teams and customers.
Success Factors
- Self-motivated and capable of working independently and planning.
- Strong technical knowledge of semiconductor packaging and assembly processes. (E.g., Wire bond base for Ag, Au, Cu, and Al wires)
- Proven ability to collaborate effectively across cross-functional teams.