About this role
Provide the necessary support for new package development initiatives, project and program management, and continuous improvement activities to drive best-in-class performance at the onsemi Carmona site. These efforts are focused on enhancing operational excellence, improving manufacturing and business performance, achieving superior quality and delivery outcomes, and driving sustainable cost reductions through effective project execution, process optimization, and productivity improvements.
Job Specifications:
• Minimum of seven years of direct experience in semiconductor operations. • Bachelor’s degree in Engineering (Mechanical, Electrical, Electronics, or Materials Science). • Extensive experience in New Package/Product Engineering, with specific expertise in assembly processes. Knowledge of metallurgy and materials science is an advantage. • Good interpersonal skills in collaborating with support groups • Highly motivated to work in a dynamic environment, with good integrity and character • Basic understanding of and ability to apply statistical analysis • Excellent communication skills Skills:
•Specific Assembly Process expertise
•Working knowledge of DOE / 6 Sigma Statistical Tools
•Working knowledge on large scale, safe launch and pre-production releases
•Working knowledge on Control Plan / FMEA, 8D and Problem Solving
•Background on Program Management, Problem Solving Skills and Business Acumen and Strategic Thinking .
•Proficient in Microsoft Office
•AutoCAD and 3D modelling is an advantage