About this role
Job Requirements
PCB Design Engineer / Senior PCB Design Engineer
Technical Skills
Ø Proficiency with Cadence Allegro PCB Editor 17.2 or above is mandatory.
Ø Strong understanding of translating schematic requirements into PCB layout requirements.
Ø Experience in component footprint and library creation (IPC‑compliant).
Ø Hands‑on expertise in PCB placement, stack‑up definition PCB routing for rigid and flex boards.
Ø Strong experience with HDI PCB designs, including blind, buried, and microvias, and via‑in‑pad technology.
Ø Good understanding of high‑speed digital design concepts, including impedance control, length matching, and differential pair routing.
Ø Experience in routing DDR2 / DDR3 memory interfaces.
Ø Strong knowledge of power supply layout, analog‑digital mixed‑signal PCBs, and ground and power plane partitioning.
Ø Experience designing rigid and flex PCB designs.
Ø Good understanding of EMI/EMC layout concepts and basic signal integrity and power integrity practices.
Ø Proficient in PCB layout design from concept through manufacturing release.
Ø Familiarity with PCB manufacturing processes, materials, and DFM/DFA guidelines.
Ø Proficiency with PCB CAD tools such as Altium Designer or Mentor Xpedition will be an added advantage.
Ø Experience generating complete fabrication and assembly documentation, including Gerbers/ODB++, drill files, stack‑up drawings, and impedance tables.
Ø Must have experience handling 20+ PCB designs, covering the complete flow from netlist import to Gerber creation using Cadence Allegro PCB Editor.
Job Responsibilities
Ø Own end‑to‑end PCB layout activities using Cadence Allegro PCB Editor (v17.2 or above) from placement to fabrication release.
Ø Define and implement PCB stack‑ups for rigid and flex PCBs, considering signal integrity, power integrity, and manufacturing constraints.
Ø Design and execute HDI PCB layouts using blind, buried, and microvias, including via‑in‑pad techniques.
Ø Create, validate, and maintain IPC‑compliant component footprints and PCB libraries.
Ø Perform high‑speed routing including DDR2 / DDR3 memory interfaces, controlled impedance traces, differential pairs, and length matching.
Ø Design and optimize power supply layouts, including ground and power plane partitioning and decoupling strategies for mixed‑signal boards.
Ø Apply EMI/EMC best practices and basic SI/PI guidelines during placement and routing to ensure reliable performance.
Ø Design analog‑digital mixed‑signal PCBs with proper isolation, return path control, and noise mitigation techniques.
Ø Generate and review complete fabrication and assembly documentation, including Gerbers/ODB++, drill files, stack‑up drawings, and impedance reports.
Ø Work closely with fabrication and assembly vendors to resolve DFM/DFA issues and support board manufacturability.
Ø Collaborate effectively with hardware designers, SI/PI/EMI/EMC engineers, mechanical teams, and manufacturing partners throughout the design cycle.
Ø Ensure adherence to PCB design standards, processes, and quality guidelines while meeting schedule and project deliverables.
Would be a Plus:
Ø Experience with 14+ layer medium complex PCBs
Ø Knowledge of EMC testing and compliance support
Ø Experience collaborating with global or cross‑site engineering teams
Communication
Ø Strong verbal and written communication skills
Ø Ability to conduct effective technical discussions with hardware, SI/PI/EMI/EMC, and manufacturing teams
Ø Clearly document and communicate PCB design decisions and trade-offs.
Preferred Qualification
Ø Bachelor’s Degree in Engineering – or Equivalent
Ø Years of Experience: 5+ Years
Job Location
· Trivandrum