Silicon Package Engineer

Meta is looking for an experienced ASIC Package Engineer to join its ASIC Packaging team. The ideal candidate will be able to prioritize competing workstreams across multiple engineering disciplines, balancing design, vendor engagement, and manufacturing timelines. They will have experience with ASIC or accelerator advanced packaging development and process integration. We are building a competency in packaging design and technology to support the development of custom silicons for Infrastructure hardware as well as to develop packaging solutions that are optimal for our AI/ML products and system level performance. In this role, you will contribute to building open and efficient machine learning platforms.

Responsibilities

Perform package design for AI/ML and networking applications custom Si with single-chip/multi-chip and SiP/module packaging, design feasibility studies and analyses to ensure good manufacturing at ODM
Lead development of disruptive advanced packaging technologies from concept to product, including test vehicle definition and building with ecosystem partners
Work with internal Si, architecture and system teams, and externally with engaged partners, ODM, design houses and OSAT companies
Perform design analysis and what-if scenarios for novel packaging schemes such as 2.5D/3D and heterogeneous integration to improve package form factor for next-generation versions of current products
Influence ASIC vendors, foundry, ODM and OSAT partners' roadmaps and align with Meta ASIC roadmaps for the development of advanced packaging technologies (SMT, solder ball attach, and other assembly process)
Participate early in Si/package/PCB/system co-design and ODM SMT manufacturing work in product development design reviews, providing feedback on manufacturability and helping incorporate the latest technology advancements and design rules
Create, conduct and analyze Design of Experiments (DOE) for development and sustaining activities
Work cross-functionally with design, NPI, quality and reliability, and manufacturing teams, and support new technology integration into products
Support selection and qualification of external partners (ODM, OEM, OSAT)
Collaborate with internal and external stakeholders to ensure seamless integration of packaging technology into product development cycles
Stay abreast of the latest advancements in advanced packaging technologies and market trends
Identify and evaluate emerging technologies with potential for future applications
Ability to travel internationally, typically once per quarter

Qualifications

Bachelors degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field, and/or equivalent practical experience
6+ years of experience in semiconductor packaging with direct ownership of advanced packaging development, assembly process, and manufacturing
In-depth knowledge of flip chip, 2.5D and 3D packaging technologies
Experience taking products from concept to production, including development of manufacturing specifications, vendor qualifications, and improvement of manufacturing efficiencies and costs
Experience communicating technical packaging decisions to cross-functional engineering teams and external partners (e.g., design reviews, vendor specifications, manufacturing readiness assessments)
Experience collaborating with cross-functional teams (e.g., Si design, architecture, system, and manufacturing) to deliver packaging solutions from concept to production
Willingness to travel internationally, typically once per quarter Hands-on experience in interposer or fanout package design for both organic and inorganic interposers with or without bridges such as CoWoS-L, CoWoS-R, EMIB, and embedded fanout bridge from OSAT
Master's degree or PhD in Materials Science, Mechanical Engineering, or a related discipline
Proven technical understanding of the full range of semiconductor packaging design, SMT processes, PCB design and layout tools, failure mechanisms and analytical techniques
Knowledge of packaging and assembly industry standards
In-depth knowledge of 2.5D and 3D packaging technologies, including silicon interposers, TSVs, and microbumps and advanced packages interaction with board-assembly constraints
Proven understanding of fanout advanced packaging technologies
Experience working with ODM, assembly packaging, OSAT, and foundry partners