SMTS Packaging Engineer

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THE ROLE :

Technology leader responsible for driving Co-Packaged Optics (CPO) and Silicon Photonics technology development from concept to high-volume manufacturing. The successful candidate will collaborate with product architects, Silicon Photonics technology teams, foundry partners, and OSATs to define future optical interconnect solutions, packaging architectures, and technology roadmaps.

This role requires deep expertise in Silicon Photonics technology and manufacturing, spanning wafer process development, device integration, optical packaging, assembly, and qualification. The candidate will lead development initiatives from concept through production, defining process requirements, DFM/DFY strategies, and yield improvement roadmaps.

The successful candidate will drive cross-functional engineering teams across multiple geographies to develop next-generation optical engine solutions, establish package architectures, and enable scalable manufacturing processes. The role also involves executive-level communication, ecosystem engagement, and technical leadership to resolve yield, reliability, process integration, and manufacturing challenges across the Silicon Photonics value chain.

THE PERSON :

Should possess a proven track record of delivering innovative photonics and packaging solution from concept to production. He/she should have extensive experience in Silicon Photonics technology development, including wafer fabrication, process integration, device manufacturing, yield improvement, and product qualification. The candidate should demonstrate strong leadership in driving technology roadmap definition, architecture development, process innovation, and manufacturing readiness across internal and external organizations.

Success in this role requires the ability to influence technical direction, lead global cross-functional teams, and effectively communicate complex technical issues and recommendations to executive management, product architects, technology partners, foundries, OSATs, and suppliers.

KEY RESPONSIBILITIES :

- Work with product architects and Silicon Photonics technology teams to define optical engine architectures, package architectures, and long-term technology roadmaps.
- Drive Silicon Photonics technology development from wafer process integration through packaging, qualification, and production deployment.
- Partner with foundries to develop and optimize Silicon Photonics manufacturing processes, yield strategies, and technology qualification plans.
- Design multi-fiber optical connectors and work with ecosystem partners to establish scalable optical connectivity solutions.
- Enable new package technology development initiatives including 2.5D, 3D, hybrid bonding, and optical packaging technologies from concept to full qualification.
- Drive test vehicle design, wafer and package characterization, and manufacturing experiments to establish design rules and DFM/DFY guidelines.
- Establish yield improvement roadmaps and drive implementation of data analytics methodologies across wafer fabrication, assembly, and test operations.
- Lead technical problem-solving activities related to process integration, yield, reliability, and manufacturing scalability.
- Build strategic relationships with foundries, OSATs, suppliers, and ecosystem partners to enable production deployment and technology leadership.

PREFERRED EXPERIENCE :

- Proven experience developing and deploying Silicon Photonics technologies and products from concept through qualification and high-volume manufacturing.
- Strong understanding of Silicon Photonics wafer fabrication, process integration, device manufacturing, yield improvement, process control, and foundry operations.
- Experience working directly with Silicon Photonics foundries on technology development, process qualification, yield enhancement, and manufacturing ramp.
- Demonstrated expertise in optical engine development, photonics couplers, fiber attach, optical assembly, and associated DFM, test, and reliability methodologies.
- Deep knowledge of advanced packaging technologies including 2.5D/3D integration, CoWoS, fan-out packaging, hybrid bonding, and heterogeneous integration.
- Proven track record of leading semiconductor technology development and qualification programs for high-performance computing, networking, or data center products.
- Strong experience managing external manufacturing partners and ecosystem stakeholders, including foundries, OSATs, suppliers, and technology partners.
- Demonstrated leadership driving global cross-functional teams and influencing technical strategy across product, technology development, and manufacturing organizations.
- Experience with statistical process control (SPC), yield analytics, reliability engineering, failure analysis, and data-driven manufacturing optimization.

ACADEMIC CREDENTIALS :

BS/MS/PhD in Material Science, Mechanical Engineering, Computer Science,  Applied Mathematics, Electrical Engineering,  or equivalent

LOCATION:

Hsinchu, Taiwan

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Benefits offered are described:  AMD benefits at a glance .

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position.  AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.