PIC Process Integration Engineer

The Photonic Integrated Circuit (PIC) group at Nokia is at the forefront of developing and producing the chips that power our terabit-scale digital optical transport networks. We’re looking for a driven and collaborative Process Integration / Fab Start-Up engineer to join our PIC Product Integration Team.

We are seeking a highly motivated and technically skilled engineer to lead the bring-up and qualification of a new Indium Phosphide (InP) photonics semiconductor fabrication facility. This role is critical to establishing high-yield, scalable, and reliable photonic device manufacturing processes in a cutting-edge fab environment. The ideal candidate will have experience with InP or compound semiconductor process development, fab tool qualification, and yield improvement.

- BS/MS/PhD in Electrical Engineering, Materials Science, or related field.
- Hands-on experience in compound semiconductor fabrication, with a strong preference for InP-based photonics.
- Understanding of semiconductor process integration, yield improvement methodologies, and cleanroom practices.
- Experience with fab tool bring-up and qualification, including troubleshooting and maintenance support.
- Strong problem-solving skills, with a data-driven mindset and familiarity with tools like JMP, Python and MES/SPC software packages.
- Experience with SPC, Design for Manufacturing (DfM), and six-sigma principles for continuous improvement is a plus.
- Excellent communication and teamwork skills; able to work in a fast-paced startup or ramp-up environment.